doc. no : qw0905-LSEG75662-LTS-PF rev. : a date : 05 - jul. - 2006 data sheet bipolar type led lamps LSEG75662-LTS-PF ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
-60 100% directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 60 50% 75%25%25% 0 75% 50%100% 30 -30 0 package dimensions ligitek electronics co.,ltd. property of ligitek only 2 1 se g 2 1 part no. 25.0min 1.0min 2.54typ 3.15 3.2 1.0max 0.5 typ 4.15 1.95 1.9 LSEG75662-LTS-PF 1/6 page
color lens material part no emitted 4.0 luminous intensity @10ma(mcd) typ. 45 spectral halfwidth nm 610 peak wave length pnm max. forward voltage @ ma(v) min. 1.8 min. viewing angle 2 1/2 (deg) 180 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a mw 20 80 se ratings 10 ir -40 ~ +85 -40 ~ +100 80 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LSEG75662-LTS-PF 30 5653.07.0180 30 10 100 120 g green orange gap gaasp/gap 1.7 white diffused 2.6 1.7 2.6 20 2/6 part no. LSEG75662-LTS-PF
40 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) ambient temperature( ) fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 750 700 650 600 550 wavelength (nm) 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 1.0 ambient temperature( ) fig.5 relative intensity vs. wavelength -20 0.8 -4020 0 0.9 80 60 40100 0.0 -40-20 020 0.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward voltage(v) fig.3 forward voltage vs. temperature 1.2 1.0 1.1 2.0 1.5 2.5 3.0 1.0 1.03.0 2.0 0.1 10 100 1.0 4.05.0 0.0 1.010 0.5 1.5 2.5 2.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 1000 se chip 3.0 100 6080 1000 100 page3/6 part no. LSEG75662-LTS-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 page part no. LSEG75662-LTS-PF
page 5/6 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max temp( c) 260 time(sec) 100 50 150 120 25 preheat 0 0 2 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. LSEG75662-LTS-PF
this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec high temperature high humidity test thermal shock test solder resistance test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test itemtest condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 part no. LSEG75662-LTS-PF
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